- High
level power integration
- One-
or two-screws-mounting to the customer heatsink, compact design
- Low
thermal impedance due to durable ceramic insulation
- Pressure
contact technology with simple connection to DCB through pressure
contact (no soldering) and with increased power cycling capability
- Low
stray inductance
- High
power density, low losses
- Integrated
temperature sensor
- Integrated
shunts for dc and ac current (optional for MiniSKiiP 1 and 2)
- Integrated
three-phase current sensor (optional for MiniSKiiP 8)
|